Manufacturing Engineering (PCB Assembly/SMT Technology)

  • Harris Corporation
  • Rochester, NY, USA
  • May 31, 2019
Full-time Computer Engineering Computer Science Oracle Product Management Programming Security Clearance

Job Description

Harris is a proven leader in tactical communications, electronic warfare, avionics, air traffic management, space and intelligence, and weather solutions.

Harris Corporation in Rochester NY has a comprehensive and advanced printed circuit board (PCB) assembly operation that includes surface mount technology (SMT), automated optical inspection (AOI), and 3D solder paste inspection (SPI).  Our world-class manufacturing facility of approximately 600,000 sq. ft, contains multiple SMT lines with industry-leading equipment, including Universal, Fuji and Koh Young. This facility is seeing rapid growth from new products and market expansion.

Harris is seeking an experienced manufacturing engineer to fill this high-visibility, hands-on position in a lead SMT processing engineering role to join our team in this fast-paced, and exciting environment. A successful candidate must have a thorough understanding of  SMT programming and support of automated placement systems, and solder reflow processes as well as an understanding in electronic product introduction and development. The programming knowledge will be utilized to perform root cause analysis on SMT issues.The successful candidate will drive improvements in all related manufacturing processes, including those related to products, equipment, human interface, and product quality.


  • Development of printed circuit board assembly strategies for new and existing products including process design and development, integration of automated solutions, and process documentation
  • Utilize SMT equipment and process knowledge to identify quality and throughput improvement opportunities and implement solutions to realize these improvements
  • Estimate manufacturing costs, determine time standards, and make recommendations for tooling and process requirements of new or existing product lines
  • Support assembly processes for existing products, including implementation of design changes, process improvements, general troubleshooting, and corrective actions
  • Interface with manufacturing, engineering, vendor and subcontractor representatives to ensure requirements are met
  • Support Design for Assembly and Design for Manufacturing efforts to drive product and process improvements
  • Standard use of HBX / Lean Six Sigma philosophy/tools for ongoing improvements. Support development and implementation of quality metrics to drive improvement and business results
  • Support production validation builds on new processes and implements modifications based on feedback
  • Uses designed experiments and FMEA techniques to identify robust processes and to improve existing ones


  • Bachelor’s Degree in Engineering or a technical field (ME, IE, or EE preferred) and minimum 9 years of prior relevant manufacturing experience. Graduate Degree and a minimum of 7 years of prior related manufacturing experience

Preferred Additional Skills:

  • Self-starter and able to work successfully with minimal supervision
  • SMT (Solder Paste Print, Pick and Place, Reflow) process knowledge of high reliability electronics, including BGA, MicroBGA, CSP, & QFN components
  • Working knowledge of IPC documentation, including IPC-A-610 and J-STD-001
  • Effective oral and written communication skills
  • Interface with Engineering for resolution of product design issues
  • Manage own workload and set priorities
  • Willingness to work and learn in fast paced production environment
  • Excellent interpersonal skills and demonstrated ability to work successfully both independently as well as in a team environment
  • Proficient computer skills, including MS Office and Oracle EBS
  • Experience with HBX (Lean/6 Sigma), 5S, and Kaizen tools and processes
  • Ability to work a flexible schedule to meet production needs

Please be aware that many of our positions require a security clearance, or the ability to obtain one. Security clearances may only be granted to U.S. citizens.  In addition, applicants who accept a conditional offer of employment may be subject to government security investigation(s) and must meet eligibility requirements for access to classified information.

By submitting your résumé for this position, you understand and agree that Harris Corporation may share your résumé, as well as any other related personal information or documentation you provide, with its subsidiaries and affiliated companies for the purpose of considering you for other available positions.

Harris is an Equal Opportunity/Affirmative Action Employer. We consider applicants without regard to race, color, religion, age, national origin, ancestry, ethnicity, gender, gender identity, gender expression, sexual orientation, marital status, veteran status, disability, genetic information, citizenship status, or membership in any other group protected by federal, state or local law.

Candidates will support Environment, Health and Safety by fulfilling the Harris EHS Policy, complying with Harris EHS programs and applicable regulations, and striving for continual EHS improvement.

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